All accepted papers of MEACM2019 will be arranged to publish in IOP Conference Series: Materials Science and Engineering（MSE） (ISSN: 1757-899X), which is indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al. Each paper will be assigned unique Digital Object Identifier (DOI) from CROSSREF.Read more
MEACM2018 has been held in Harbin on December 7-8, 2018 successfully.Read more
Prospective authors are invited to submit original papers (not being considered for publication elsewhere) in standard format describing new theoretical and/or experimental research.Read more
The registration include publication fee and participation fee, please choose the proper item for you and complete the registration before due date.
2019 3 rd International Conference on Mechanical Engineering and Applied Composite Materials (MEACM2019) will be held on November 22-23,2019 | Singapore.
The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from mechanical engineering and applied composite materials to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.
Papers submitted to MEACM2019 will be reviewed by technical committees of the conference. All accepted and registered papers will be published in IOP Conference Series: Materials Science and Engineering (MSE)(ISSN:1757-899X). And all papers will be submitted to EI Compendex and many other major databases.
The major scope of MEACM will cover all relevant aspects of the science and technology of composite materials included in but not limited to the overall professional theme areas of Nanocomposites, Structures and Design, Damage and Failure, Fatigue, Dynamic Effects, Novel Material Systems, Experimental Characterization, Health/Condition Monitoring, Smart/adaptive Material Systems.
2019年机械工程与应用复合材料国际会议 (MEACM2019) 将于2019年11月22-23日在新加坡召开. 详情请点击
·Academics: Communicate your research results and find out about research being conducted around the world.
·Consultants: Demonstrate the power of mechanical engineering and applied composite materials in client work and see what others are doing.
·Practitioners: Show what is being done in your organization and learn what is happening elsewhere.
·Students: Share your research, get feedback, and discover research directions and collaborators.
·Educators: Let people know what you are doing and see what is being done with students at all levels.
·Managers and Policy Makers: Discover new directions for your organization.
·Network with hundreds of other students, academics, consultants and professionals involved in mechanical engineering and applied composite materials.
·Receive current updates on a range of topics, from leaders and expert practitioners.
·Learn about the particular benefits and uses of different modeling approaches.
·Meet the sponsors and exhibitors and learn about their new developments.
·Progress your career or search for job candidates.
·Learn about the latest work and research and see its implications for you.
·Enhance your skill set with workshops and see the work.
·Explore and debate topics, discuss in formal and informal settings.
·Present your research, project, or product and get feedback.
·Promote your work.
All papers accepted by MEACM2018 has been successfully indexed by EI Compendex.
November 16, 2019 December10, 2019
November 23, 2019 December13, 2019
November 30, 2019 December17, 2019
Conference Date: November 22-23, 2019
Prof. Steven Y. Liang
Georgia Institute of Technology, USA
Prof. Dr. Farid Nasir bin Ani
Universiti Teknologi Malaysia, Malaysia
Prof. Jacob Opadeyi
The University of the West Indies, Trinidad and Tobago
Prof. Dr. Mohammad Nazri bin Mohd. Ja'afar
Universiti Teknologi Malaysia, Malaysia
"Prof. Dr. Md Mustafizur Rahman
Universiti Malaysia Pahang, Malaysia
Assoc. Prof. Jiyun Zhao
City University of Hong Kong, Hong Kong
Assoc. Prof. Yongsheng Chen
The Chinese University of Hong Kong